New Advanced Circuits PCB Board Materials! br These new materials can be utilized for: Integrity Designs requiring miniaturization, Advanced HDI, Stacked Microvias, Multilayer Advanced RF and Microwave. br br Advanced Circuits offers Integral Technology's Zeta Lam high density interconnect product Halogen-free UL Certified Materials br High Speed Ultra Low Dk & New RF Products br Rogers 2929 Bondply br 3M ECM (Embedded Capacitance Material) br ROHACELL br Zeta Lam SE br br br Advanced Circuits maintains a documented printed circuit board manufacturing and assembly "Quality Management System" designed and implemented to fulfill the requirements of our PCB customers.